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FSEA to Sponsor Programming at UV+EB Packaging Conference

Foil & Specialty Effects Association

The Foil & Specialty Effects Association will host an education track during RadTech International North America's UV+EB Packaging Conference, a one-day event on Oct. 24 in Philadelphia, Pennsylvania.

At the conference, RadTech will host presentations on migration, regulatory issues and the latest developments in UV- and EB-curable inks, coatings and adhesives for food and consumer goods packaging. A keynote on Printing Inks for Food Contact Materials at Nestlé will be given by Amaury Patin, Nestlé Research Center.

FSEA's track – from 1 to 3 p.m. – includes such topics as UV-cured coatings, adhesives and foils. Scheduled speakers include:

  • Cold Foil Technology – UV Cured Adhesives and Foils
    Mike King, Eagle Systems, Inc.
    1 to 1:30 p.m.
  • Analysis of Specialty UV Coatings for Packaging and Printing
    Helen Rallis, Sun Chemical Corporation
    1:30 to 2 p.m.
  • UV LED Technology and Its Increasing Use in Specialty Curing Applications
    Jennifer Heathcote, Phoseon Technology
    2 to 2:30 p.m.
  • Impact of High Visibility Enhancements On Shelf Presence (Foils and Coatings)
    Jeff Peterson, Foil & Specialty Effects Association
    2:30 to 3 p.m.

The RadTech Fall Member Meeting will take place the day after the UV+EB Packaging Conference on Oct. 25. To register or view additional information, visit www.RadTech.org/uveb2017.